Invention Grant
US07825519B2 Method and device for wafer scale packaging of optical devices using a scribe and break process
有权
使用划痕和断裂工艺的光学器件的晶片级封装的方法和装置
- Patent Title: Method and device for wafer scale packaging of optical devices using a scribe and break process
- Patent Title (中): 使用划痕和断裂工艺的光学器件的晶片级封装的方法和装置
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Application No.: US12029899Application Date: 2008-02-12
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Publication No.: US07825519B2Publication Date: 2010-11-02
- Inventor: Xiao Yang , Dongmin Chen , Philip Chen
- Applicant: Xiao Yang , Dongmin Chen , Philip Chen
- Applicant Address: US CA Santa Clara
- Assignee: Miradia Inc.
- Current Assignee: Miradia Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.
Public/Granted literature
- US20080191221A1 METHOD AND DEVICE FOR WAFER SCALE PACKAGING OF OPTICAL DEVICES USING A SCRIBE AND BREAK PROCESS Public/Granted day:2008-08-14
Information query
IPC分类:
