Invention Grant
- Patent Title: Semiconductor chip having bond pads
- Patent Title (中): 具有接合垫的半导体芯片
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Application No.: US11616852Application Date: 2006-12-27
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Publication No.: US07825523B2Publication Date: 2010-11-02
- Inventor: Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
- Applicant: Young-Hee Song , Il-Heung Choi , Jeong-Jin Kim , Hae-Jeong Sohn , Chung-Woo Lee
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor package includes a semiconductor substrate having integrated circuits formed on a cell region and a peripheral circuit region adjacent to each other. A bond pad-wiring pattern is formed on the semiconductor substrate. A pad-rearrangement pattern is electrically connected to the bond pad-wiring pattern, The pad-rearrangement pattern includes a bond pad disposed over at least a part of the cell region.
Public/Granted literature
- US20070108562A1 Semiconductor chip having bond pads Public/Granted day:2007-05-17
Information query
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