Invention Grant
- Patent Title: QFN housing having optimized connecting surface geometry
- Patent Title (中): QFN外壳具有优化的连接表面几何形状
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Application No.: US11731054Application Date: 2007-03-30
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Publication No.: US07825524B2Publication Date: 2010-11-02
- Inventor: Anton Doering , Stefan Mueller , Frieder Haag , Christoph Gahn
- Applicant: Anton Doering , Stefan Mueller , Frieder Haag , Christoph Gahn
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102006015222 20060330
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor system or sensor system in a housing which is butt-joined to a printed circuit board by soldering, at least some of the connecting surfaces not being soldered over their entire area, the connecting surfaces which are not soldered over their entire area being fixedly soldered in a first surface region to a section of a printed conductor, and in a second surface region the connecting surfaces not being fixedly connected to the printed circuit board, the securely soldered surface regions being situated closer to the semiconductor or sensor structure to be contacted than are the surface regions which are not fixedly connected to the printed circuit board.
Public/Granted literature
- US20070232095A1 QFN housing having optimized connecting surface geometry Public/Granted day:2007-10-04
Information query
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