Invention Grant
US07825528B2 Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same
有权
用于封装半导体器件的环氧树脂组合物及其制造方法以及使用其的半导体器件
- Patent Title: Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same
- Patent Title (中): 用于封装半导体器件的环氧树脂组合物及其制造方法以及使用其的半导体器件
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Application No.: US11496449Application Date: 2006-08-01
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Publication No.: US07825528B2Publication Date: 2010-11-02
- Inventor: Jo Gyun Kim , Kun Bae Noh , Yoon Kok Park
- Applicant: Jo Gyun Kim , Kun Bae Noh , Yoon Kok Park
- Applicant Address: KR Gyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gyeongsangbuk-do
- Agency: Lee & Morse P.C.
- Priority: KR10-2005-0070477 20050802; KR10-2005-0091006 20050929
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08L63/00 ; C08K3/36 ; B32B27/04 ; B32B27/20 ; B32B27/26 ; B32B27/38
Abstract:
An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4′-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.
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