Invention Grant
- Patent Title: Antenna assembly
- Patent Title (中): 天线组件
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Application No.: US12104013Application Date: 2008-04-16
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Publication No.: US07825860B2Publication Date: 2010-11-02
- Inventor: Zhinong Ying
- Applicant: Zhinong Ying
- Applicant Address: SE Lund
- Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee: Sony Ericsson Mobile Communications AB
- Current Assignee Address: SE Lund
- Agency: Harrity & Harrity, LLP
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/24

Abstract:
An antenna assembly may include a printed wiring board (PWB) and a dielectric substrate including a first antenna pattern, the dielectric substrate being configured to be mounted on the PWB. The antenna assembly may include a second antenna pattern that may be configured to be used as a radiating element of an FM Tx antenna or a Near Field Communication (NFC) antenna. The second antenna pattern may be provided a) on/in the dielectric substrate, or b) on the PWB at the interface between the dielectric substrate and the PWB, or c) partly on a surface of the dielectric substrate and partly on a surface of said PWB.
Public/Granted literature
- US20090262022A1 ANTENNA ASSEMBLY Public/Granted day:2009-10-22
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