Invention Grant
- Patent Title: Radio module
- Patent Title (中): 无线电模块
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Application No.: US11825066Application Date: 2007-07-03
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Publication No.: US07825861B2Publication Date: 2010-11-02
- Inventor: Koichi Sato , Yusuke Miura
- Applicant: Koichi Sato , Yusuke Miura
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2006-188578 20060707
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
A conductor is mounted on a circuit board parallel to its side along which a radiation of a radio frequency signal is generated. The proximal end of the L-shaped conductor is electrically connected to a ground pattern formed on the rear surface of a circuit board 1, and the distal end of the L-shaped conductor is open. The position at which the conductor is connected to the ground pattern is set to be a position spaced apart by a quarter-wavelength of a radio-frequency signal from a feed point of an antenna. The total length of the conductor is set to be a half-wavelength of the radio-frequency signal.
Public/Granted literature
- US20080007468A1 Radio module Public/Granted day:2008-01-10
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