Invention Grant
- Patent Title: Thermal response correction system
- Patent Title (中): 热响应校正系统
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Application No.: US11888764Application Date: 2007-08-02
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Publication No.: US07825943B2Publication Date: 2010-11-02
- Inventor: Brian D. Busch , Suhail S. Saquib , William T. Vetterling
- Applicant: Brian D. Busch , Suhail S. Saquib , William T. Vetterling
- Applicant Address: VG
- Assignee: Mitcham Global Investments Ltd.
- Current Assignee: Mitcham Global Investments Ltd.
- Current Assignee Address: VG
- Agency: Lowe Hauptman Ham & Berner, LLP
- Main IPC: B41J2/00
- IPC: B41J2/00

Abstract:
A model of a thermal print head is provided that models the thermal response of thermal print head elements to the provision of energy to the print head elements over time. The amount of energy to provide to each of the print head elements during a print head cycle to produce a spot having the desired density is calculated based on: (1) the desired density to be produced by the print head element during the print head cycle, (2) the predicted temperature of the print head element at the beginning of the print head cycle, (3) the ambient printer temperature at the beginning of the print head cycle, and (4) the ambient relative humidity.
Public/Granted literature
- US20080040066A1 Thermal response correction system Public/Granted day:2008-02-14
Information query
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