Invention Grant
US07826068B2 Method for correcting measured values resulting from the bending of a substrate 有权
用于校正由基板弯曲产生的测量值的方法

Method for correcting measured values resulting from the bending of a substrate
Abstract:
A method for correcting the measured values of positions of structures (3) on a substrate (2) resulting from bending of a substrate (2) is disclosed. A plurality of geometric parameters of the substrate (2) are determined. A plurality of physical parameters of the substrate (2) are determined. A degree of bending is calculated individually for each substrate (2) on the basis of the obtained geometric parameters, the physical parameters and the position of the support points (40). The measured position data of the structures (3) on the substrate (2) is corrected with the aid of each individually calculated degree of bending.
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