Invention Grant
- Patent Title: Method for correcting measured values resulting from the bending of a substrate
- Patent Title (中): 用于校正由基板弯曲产生的测量值的方法
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Application No.: US12147974Application Date: 2008-06-27
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Publication No.: US07826068B2Publication Date: 2010-11-02
- Inventor: Slawomir Czerkas
- Applicant: Slawomir Czerkas
- Applicant Address: DE Weilburg
- Assignee: Vistec Semiconductor Systems GmbH
- Current Assignee: Vistec Semiconductor Systems GmbH
- Current Assignee Address: DE Weilburg
- Agency: Houston Eliseeva, LLP
- Priority: DE102007035519 20070726
- Main IPC: G01B11/24
- IPC: G01B11/24

Abstract:
A method for correcting the measured values of positions of structures (3) on a substrate (2) resulting from bending of a substrate (2) is disclosed. A plurality of geometric parameters of the substrate (2) are determined. A plurality of physical parameters of the substrate (2) are determined. A degree of bending is calculated individually for each substrate (2) on the basis of the obtained geometric parameters, the physical parameters and the position of the support points (40). The measured position data of the structures (3) on the substrate (2) is corrected with the aid of each individually calculated degree of bending.
Public/Granted literature
- US20090030639A1 Method for Correcting Measured Values Resulting from the Bending of a Substrate Public/Granted day:2009-01-29
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