Invention Grant
US07826222B2 Front-to-back cooling system for modular systems with orthogonal midplane configuration
有权
具有正交中平面配置的模块化系统的前后冷却系统
- Patent Title: Front-to-back cooling system for modular systems with orthogonal midplane configuration
- Patent Title (中): 具有正交中平面配置的模块化系统的前后冷却系统
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Application No.: US12167604Application Date: 2008-07-03
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Publication No.: US07826222B2Publication Date: 2010-11-02
- Inventor: Gunes Aybay , Jean-Marc Frailong , Sindhu Pradeep , David J. Lima
- Applicant: Gunes Aybay , Jean-Marc Frailong , Sindhu Pradeep , David J. Lima
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Akin Gump Strauss Hauer & Feld
- Agent Sanford E. Warren, Jr.
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.
Public/Granted literature
- US20100002382A1 FRONT-TO-BACK COOLING SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL MIDPLANE CONFIGURATION Public/Granted day:2010-01-07
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