Invention Grant
- Patent Title: Electric power converter and mounting structure of semiconductor device
- Patent Title (中): 电力转换器和半导体器件的安装结构
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Application No.: US12457245Application Date: 2009-06-04
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Publication No.: US07826226B2Publication Date: 2010-11-02
- Inventor: Hiroshi Ishiyama
- Applicant: Hiroshi Ishiyama
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-297833 20030821; JP2003-299248 20030822
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/06
Abstract:
An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
Public/Granted literature
- US20090251858A1 Electric power converter and mounting structure of semiconductor device Public/Granted day:2009-10-08
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