Invention Grant
- Patent Title: Component retention with distributed compression
- Patent Title (中): 组件保留与分布式压缩
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Application No.: US11588817Application Date: 2006-10-27
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Publication No.: US07826229B2Publication Date: 2010-11-02
- Inventor: Stephen Daniel Cromwell , Stephan Karl Barsun
- Applicant: Stephen Daniel Cromwell , Stephan Karl Barsun
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34 ; H01R13/62
Abstract:
A retention assembly comprises a hinged load plate configured for rotational closure over a component and compression of a pre-compressed spring that distributes force of the spring across the component in tool-less retention of the component.
Public/Granted literature
- US20080101033A1 Component retention with distributed compression Public/Granted day:2008-05-01
Information query
