Invention Grant
- Patent Title: Server enclosure with transfer card module
- Patent Title (中): 带转接卡模块的服务器机箱
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Application No.: US12110315Application Date: 2008-04-26
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Publication No.: US07826230B2Publication Date: 2010-11-02
- Inventor: Sheng-Hung Lee , Che-Jui Chang , Si-Lek Lao , Li-Ping Chen
- Applicant: Sheng-Hung Lee , Che-Jui Chang , Si-Lek Lao , Li-Ping Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200820300456U 20080327
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
The invention relates to a server enclosure with a transfer card module with a chassis having a side, a mounting bracket attached to the side of the chassis, and a transfer card secured to the mounting bracket. The mounting bracket includes a first sidewall and an opposite second sidewall. A first receiving slot is defined between the first sidewall and the second sidewall. The transfer card includes a printed circuit board. A first connector and a second connector are disposed on one side of the printed circuit board. The first connector is located between the printed circuit board and the first sidewall of the mounting bracket. The second connector is proximate to the mounting bracket and aligned with the first receiving slot of the mounting bracket.
Public/Granted literature
- US20090244861A1 SERVER ENCLOSURE WITH TRANSFER CARD MODULE Public/Granted day:2009-10-01
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