Invention Grant
- Patent Title: Semiconductor laser device including transparent electrode
- Patent Title (中): 半导体激光器件包括透明电极
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Application No.: US11850603Application Date: 2007-09-05
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Publication No.: US07826512B2Publication Date: 2010-11-02
- Inventor: Tetsuzo Ueda , Masaaki Yuri
- Applicant: Tetsuzo Ueda , Masaaki Yuri
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2004-182651 20040621
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S3/097

Abstract:
It is an object of the present invention to provide a semiconductor laser device with high-yielding in which a clack generated in an epitaxial growth layer is restrained and to the manufacturing method thereof, the semiconductor laser device includes a GaN substrate 1, an n-type GaN layer 2, an n-type AlGaN cladding layer 3, a n-type GaN guide layer 4, an InGaN multiple quantum well active layer 5, an undoped-GaN guide layer 6, a p-type AlGaN electron overflow suppression layer 7, a p-type GaN guide layer 8, a SiO2 blocking layer 9, an Ni/ITO cladding layer electrode 10 as a transparent electrode, a Ti/Au pad electrode 11, and a Ti/Al/Ni/Au electrode 12. The SiO2 blocking layer 9 is formed above the InGaN multiple quantum well active layer 5 so as to have an opening. The Ni/ITO cladding layer electrode 10 is formed inside the opening, and which is transparent for the light from the InGaN multiple quantum well active layer, and serves as a cladding layer.
Public/Granted literature
- US20080008220A1 SEMICONDUCTOR LASER DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2008-01-10
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