Invention Grant
US07826738B2 Semiconductor integrated circuit device, data recording device, and layout method for semiconductor integrated circuit device
有权
半导体集成电路器件，数据记录器件和半导体集成电路器件的布局方法
- Patent Title: Semiconductor integrated circuit device, data recording device, and layout method for semiconductor integrated circuit device
- Patent Title (中): 半导体集成电路器件，数据记录器件和半导体集成电路器件的布局方法
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Application No.: US12003838Application Date: 2008-01-02
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Publication No.: US07826738B2Publication Date: 2010-11-02
- Inventor: Chisato Higuchi , Yoshinobu Amano
- Applicant: Chisato Higuchi , Yoshinobu Amano
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-003799 20070111; JP2007-304989 20071126
- Main IPC: G03B17/00
- IPC: G03B17/00 ; H01L29/41 ; H01L21/00
Abstract:
A first image data interface section is disposed in an electrode region and an input/output buffer region provided along a first side of a semiconductor chip. A second image data interface section is disposed in an electrode region and an input/output buffer region provided along a second side. A first memory interface section is disposed in an electrode region and an input/output buffer region provided along a third side. A second memory interface section is disposed in an electrode region and an input/output buffer region provided along a fourth side.
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