Invention Grant
- Patent Title: Method and system for laying out perforation patterns
- Patent Title (中): 铺设穿孔图案的方法和系统
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Application No.: US11756314Application Date: 2007-05-31
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Publication No.: US07826917B2Publication Date: 2010-11-02
- Inventor: George Wengler
- Applicant: George Wengler
- Applicant Address: US IL Chicago
- Assignee: USG Interiors, Inc.
- Current Assignee: USG Interiors, Inc.
- Current Assignee Address: US IL Chicago
- Agency: Leydig, Voit & Mayer, Ltd.
- Agent Pradip K. Sahu; Philip T. Petti
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F19/00

Abstract:
A method and system for automating the layout of perforation patterns is described. An embodiment of the invention includes an innovative software application running on a computer, which application allows a perforation designer to select lines or arcs that comprise edges of a building panel. The application determines a starting hole spacing based on the average distance through the geometric center of the panel, and a default perforation pattern is laid out on a computer aided drawing. The application provides the user with detailed information about the perforation layout such as number of perforations, panel area, and percentage of open area. The application further allows the user to change any parameter such as hole size, hole spacing, hole shape, and edge spacing. After any user adjustment of the parameters, the application automatically updates the perforation pattern.
Public/Granted literature
- US20080301572A1 METHOD AND SYSTEM FOR LAYING OUT PERFORATION PATTERNS Public/Granted day:2008-12-04
Information query