Invention Grant
- Patent Title: Protocol method apparatus and system for the interconnection of electronic systems
- Patent Title (中): 用于电子系统互连的协议方法装置和系统
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Application No.: US12146474Application Date: 2008-06-26
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Publication No.: US07827334B2Publication Date: 2010-11-02
- Inventor: Ross E. Teggatz , Wayne T. Chen
- Applicant: Ross E. Teggatz , Wayne T. Chen
- Applicant Address: US TX Richardson
- Assignee: Triune IP LLC
- Current Assignee: Triune IP LLC
- Current Assignee Address: US TX Richardson
- Agency: Konczal Law Firm PLLC
- Main IPC: G06F13/42
- IPC: G06F13/42 ; G06F15/173 ; G06F15/00 ; G06F1/32

Abstract:
Disclosed are methods, apparatus, and systems for the interconnection of electronic system apparatus having one or more different communication protocols. A preferred embodiment is disclosed in which a single physical interface and a single protocol are used for providing an efficient and scalable interconnection between a host and operably coupled subsystem apparatus connected to the MMC. In a disclosed method, a bus is provided for coupling a system host to a plurality of system components and a Multi-Management Protocol (MMP) is employed. The Multi-Management Protocol includes a plurality of subclasses, each further including component identity information and function data. The subclasses are grouped by functionality into at least two groups comprising a standard group and an extension group. In a multi-component electronic system according to the invention, an electronic protocol packet structure includes a starting frame delimiter, a length field, a target address field, a subclass identifier, an operation identifier, a data field, and a frame check field. Disclosed preferred embodiments also include protocol conversion apparatus having a Multi-Management Controller (MMC) using a host bus for transmitting and receiving data between a host and the MMC based on a Multi-Management Protocol (MMP).
Public/Granted literature
- US20090327543A1 Protocol Method Apparatus and System for the Interconnection of Electronic Systems Public/Granted day:2009-12-31
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