Invention Grant
- Patent Title: Efficient electromagnetic modeling of irregular metal planes
- Patent Title (中): 不规则金属平面的高效电磁建模
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Application No.: US11849346Application Date: 2007-09-03
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Publication No.: US07827514B2Publication Date: 2010-11-02
- Inventor: Michael W. Beattie , Anirudh Devgan , Byron L. Krauter , Hui Zheng
- Applicant: Michael W. Beattie , Anirudh Devgan , Byron L. Krauter , Hui Zheng
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Libby Z. Handelsman; Jack V. Musgrove
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method of modeling electromagnetism in an irregular conductive plane, by dividing the surface into a grid of unequal and unaligned rectangles, assigning a circuit node location to a center of each rectangle, and calculating capacitive and inductive parameters based on the center circuit node locations. Rectangulation is accomplished using automated, recursive bisection. Capacitive segments are assigned to each circuit node and coincide with the corresponding rectangles. Inductive segments are assigned between adjacent rectangle pairs, with a width of an inductive segment defined as the common boundary of the corresponding pair of rectangles and the length of the inductive segment defined as the normal distance between circuit nodes of the two rectangles. Placement of the circuit nodes at the centers of the rectangles significantly reduces the number of nodes and segments, and provides a faster yet comprehensive analysis framework.
Public/Granted literature
- US20070300191A1 EFFICIENT ELECTROMAGNETIC MODELING OF IRREGULAR METAL PLANES Public/Granted day:2007-12-27
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