Invention Grant
US07827515B2 Package designs for fully functional and partially functional chips 有权
功能齐全的功能芯片的封装设计

Package designs for fully functional and partially functional chips
Abstract:
A method including obtaining an operational status of a first processor core, where the first processor core is associated with a plurality of processor cores located on a chip; configuring a first IO block of a package design based on the operational status of the first processor core, where the package design is based on a fully functional chip; and configuring a stackup of the package design after configuring the first IO block for use with the chip.
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