发明授权
- 专利标题： Heat sink and information processor using heat sink
- 专利标题（中）： 散热片和信息处理器采用散热片
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申请号： US10230992申请日： 2002-08-30
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公开(公告)号： US07828045B2公开(公告)日： 2010-11-09
- 发明人: Tadashi Katsui
- 申请人： Tadashi Katsui
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP9-039468 19970224; JP9-138852 19970528; JP9-301991 19971104
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
The present invention relates to a heat sink. More particularly, the present invention relates to a heat sink used for radiating heat from an integrated circuit package such as a micro-processor arranged in a portable type electronic apparatus such as a notebook type personal computer and also used for radiating heat from a hard disk unit used in an electronic apparatus. The heat sink comprises: a heat transmitting member for transmitting heat generated by a heating component; a holding section for holding the heat transmitting member; and a heat sink body having a space in which a cooling fan having at least blades and a drive motor is embedded, wherein a portion of the holding section for holding the heat transmitting member, the portion being located below the space, is cut out.
公开/授权文献
- US20020195232A1 Heat sink and information processor using heat sink 公开/授权日：2002-12-26