发明授权
US07829982B2 Lead frame, sensor including lead frame and method of forming sensor including lead frame
失效
引线框架，传感器，包括引线框架和形成传感器的方法，包括引线框架
- 专利标题： Lead frame, sensor including lead frame and method of forming sensor including lead frame
- 专利标题（中）： 引线框架，传感器，包括引线框架和形成传感器的方法，包括引线框架
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申请号： US11355175申请日： 2006-02-16
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公开(公告)号： US07829982B2公开(公告)日： 2010-11-09
- 发明人: Kenichi Shirasaka , Hiroshi Saitoh
- 申请人： Kenichi Shirasaka , Hiroshi Saitoh
- 申请人地址： JP Shizuoka-ken
- 专利权人： Yamaha Corporation
- 当前专利权人： Yamaha Corporation
- 当前专利权人地址： JP Shizuoka-ken
- 代理机构： Dickstein Shapiro LLP
- 优先权： JPP2005-042133 20050218; JPP2005-088180 20050325
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A lead frame includes a frame body defining an internal region, a plurality of leads extending from the frame body, and first and second stages that are disposed in the internal region. The first and second stages are sloped and are parallel to a first line along which a primary stream of a molten resin runs, so that slope angles of the stages are not substantially changed by the injection of the molten resin into the cavity.