发明授权
- 专利标题: Semiconductor laser device
- 专利标题(中): 半导体激光器件
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申请号: US12204223申请日: 2008-09-04
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公开(公告)号: US07830930B2公开(公告)日: 2010-11-09
- 发明人: Akira Tanaka
- 申请人: Akira Tanaka
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Turocy & Watson, LLP
- 优先权: JP2007-230192 20070905
- 主分类号: H01S3/13
- IPC分类号: H01S3/13 ; H01S3/00 ; H01S3/097
摘要:
A semiconductor laser device includes: a laminated body including an active layer, a cladding layer provided on the active layer, and a contact layer provided on the cladding layer, the laminated body having a first and second end face forming a resonator for light emitted from the active layer; and an electrode provided on the contact layer and including an ohmic section injecting a current into the active layer and a first current adjustment section provided between one end of the ohmic section and the first end face. The ohmic section contains a metal which has a smaller work function than any metal constituting the current adjustment section.
公开/授权文献
- US20090067464A1 SEMICONDUCTOR LASER DEVICE 公开/授权日:2009-03-12
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