发明授权
US07831810B2 Communicating signals between semiconductor chips using round-robin-coupled micropipelines
有权
使用循环耦合的微量管道在半导体芯片之间传递信号
- 专利标题: Communicating signals between semiconductor chips using round-robin-coupled micropipelines
- 专利标题(中): 使用循环耦合的微量管道在半导体芯片之间传递信号
-
申请号: US11865998申请日: 2007-10-02
-
公开(公告)号: US07831810B2公开(公告)日: 2010-11-09
- 发明人: Scott M. Fairbanks
- 申请人: Scott M. Fairbanks
- 申请人地址: US CA Redwood Shores
- 专利权人: Oracle America, Inc.
- 当前专利权人: Oracle America, Inc.
- 当前专利权人地址: US CA Redwood Shores
- 代理机构: Park, Vaughan, Fleming & Dowler LLP
- 主分类号: G06F9/00
- IPC分类号: G06F9/00 ; G06F15/00
摘要:
Embodiments of the present invention provide a system for transferring data between a receiver chip and a transmitter chip. The system includes a set of data path circuits in the transmitter chip and a set of data path circuits in the receiver chip coupled to a shared data channel. In addition, the system includes a set of asynchronous control circuits for controlling corresponding data path circuits in the transmitter chip and receiver chip. Upon detecting the transition of a control signal for an asynchronous control circuit in the transmitter chip, the asynchronous control circuit is configured to enable a transfer of data from the corresponding data path circuit in the transmitter chip across the data channel to a corresponding data path circuit in the receiver chip, and generate a control signal to cause a next asynchronous control circuit to commence the transfer of a data signal.
公开/授权文献
信息查询