发明授权
- 专利标题: Method for forming metal line and method for manufacturing display substrate by using the same
- 专利标题(中): 金属线形成方法及其制造方法
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申请号: US11862837申请日: 2007-09-27
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公开(公告)号: US07833075B2公开(公告)日: 2010-11-16
- 发明人: Min-Seok Oh , Sang-Gab Kim , Shin-Il Choi , Hong-Kee Chin , Yu-Gwang Jeong , Seung-Ha Choi
- 申请人: Min-Seok Oh , Sang-Gab Kim , Shin-Il Choi , Hong-Kee Chin , Yu-Gwang Jeong , Seung-Ha Choi
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: H.C. Park & Associates, PLC
- 优先权: KR10-2006-0095442 20060929
- 主分类号: H01J1/62
- IPC分类号: H01J1/62 ; H01J63/04 ; H01J9/24
摘要:
In a method for forming a metal line, a first metal layer and a second metal layer are deposited on a substrate. The first metal layer includes aluminum, and the second metal layer includes molybdenum. A photoresist pattern having a line-shape is formed on the second metal layer. The second metal layer is etched with a chlorine-containing etching gas using the photoresist pattern as a mask. The first metal layer is then etched with a mixture of a chlorine-containing gas and nitrogen gas and/or a mixture of a chlorine-containing gas and argon gas as an etching gas. Impurities such as chlorine ions are removed from the base substrate after etching the first metal layer with a fluorine-containing gas, hydrogen gas, or water vapor. A method for manufacturing a display substrate is disclosed using the method for forming a metal line to form source, drain, and gate electrodes and gate lines.
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