According to one embodiment, an imprinting method includes applying a resist to a substrate, imprinting a stamper on which protruded patterns are formed against the resist applied to the substrate, forcing a distal end of a peeling wedge into a part between the substrate and the stamper, and introducing a gas between the substrate and the stamper to peel off the stamper from the substrate, in which a gap between the substrate and the stamper is made larger than a thickness of the resist at a part into which the distal end of the peeling wedge is forced.