发明授权
- 专利标题： Removing solution
- 专利标题（中）： 清除解决方案
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申请号： US10525249申请日： 2003-08-21
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公开(公告)号： US07833957B2公开(公告)日： 2010-11-16
- 发明人: Mitsushi Itano , Takashi Kanemura , Shingo Nakamura , Fumihiro Kamiya , Takehiko Kezuka
- 申请人： Mitsushi Itano , Takashi Kanemura , Shingo Nakamura , Fumihiro Kamiya , Takehiko Kezuka
- 申请人地址： JP Osaka
- 专利权人： Daikin Industries, Ltd.
- 当前专利权人： Daikin Industries, Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2002-242392 20020822; JP2002-299657 20021011
- 国际申请： PCT/JP03/10547 WO 20030821
- 国际公布： WO2004/019134 WO 20040304
- 主分类号： C11D7/50
- IPC分类号： C11D7/50
摘要：
The present invention provides a resist-removing solution for low-k film and a cleaning solution for via holes or capacitors, the solutions comprising hydrogen fluoride (HF) and at least one member selected from the group consisting of organic acids and organic solvents. The invention also provides a method of removing resist and a method of cleaning via holes or capacitors by the use of the solutions.
公开/授权文献
- US20060138399A1 Removing solution 公开/授权日：2006-06-29
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