发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US12232887申请日： 2008-09-25
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公开(公告)号： US07834418B2公开(公告)日： 2010-11-16
- 发明人: Shinichi Uchida
- 申请人： Shinichi Uchida
- 申请人地址： JP Kawasaki, Kanagawa
- 专利权人： NEC Electronics Corporation
- 当前专利权人： NEC Electronics Corporation
- 当前专利权人地址： JP Kawasaki, Kanagawa
- 代理机构： McGinn IP Law Group, PLLC
- 优先权： JP2007-255386 20070928
- 主分类号： H01L29/00
- IPC分类号： H01L29/00
摘要：
A semiconductor device (100) includes a semiconductor substrate (2), an inductor (4) provided on the semiconductor substrate (2), a metal ball (8) provided on the inductor (4) so as to come into contact with the inductor (4), and a bonding wire (10) electrically connected to the metal ball (8). The semiconductor device (100) exchanges signals with an external via the inductor (4) and the metal ball (8). The inductor (4) also serves as the bonding pad and therefore the inductor and the bonding pad need not to be arranged in pairs.
公开/授权文献
- US20090085208A1 Semiconductor device 公开/授权日：2009-04-02
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