发明授权
US07834435B2 Leadframe with extended pad segments between leads and die pad, and leadframe package using the same
有权
引线框架与导线和裸片焊盘之间的扩展焊盘段，以及使用其的引线框封装
- 专利标题： Leadframe with extended pad segments between leads and die pad, and leadframe package using the same
- 专利标题（中）： 引线框架与导线和裸片焊盘之间的扩展焊盘段，以及使用其的引线框封装
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申请号： US12177879申请日： 2008-07-22
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公开(公告)号： US07834435B2公开(公告)日： 2010-11-16
- 发明人: Nan-Jang Chen , Hong-Chin Lin
- 申请人： Nan-Jang Chen , Hong-Chin Lin
- 申请人地址： TW Science-Based Industrial Park, Hsin-Chu
- 专利权人： Mediatek Inc.
- 当前专利权人： Mediatek Inc.
- 当前专利权人地址： TW Science-Based Industrial Park, Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.
公开/授权文献
- US20080290486A1 LEADFRAME PACKAGE 公开/授权日：2008-11-27
信息查询
IPC分类:
