发明授权
- 专利标题： Electronic circuit connection structure and its manufacturing method
- 专利标题（中）： 电子电路连接结构及其制造方法
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申请号： US11996999申请日： 2006-09-27
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公开(公告)号： US07835160B2公开(公告)日： 2010-11-16
- 发明人: Kenichi Yamamoto , Daisuke Suetsugu , Daido Komyoji , Takashi Imanaka , Hirotaka Hisamura
- 申请人： Kenichi Yamamoto , Daisuke Suetsugu , Daido Komyoji , Takashi Imanaka , Hirotaka Hisamura
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2005-281759 20050928; JP2005-354401 20051208
- 国际申请： PCT/JP2006/319178 WO 20060927
- 国际公布： WO2007/037275 WO 20070405
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.
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