An electronic component conveying apparatus is provided in which an electronic component is accommodated in a through-hole of a conveyer table and is conveyed. The electronic component can be reliably picked up from the through-hole using a compressed gas in a short time. In addition, undesired exhaust of the electronic component due to a residual compressed air can be prevented, and the conveying efficiency can be increased. In an workpiece conveying apparatus, a first surface of a conveyer table includes a pressure relief groove that extends from a location at which the pressure relief groove overlaps with an exhaust hole in a direction crossing a conveying direction and communicates with a suction recess portion when the conveyer table is rotationally driven. Alternatively, the first surface includes a pressure relief hole for relieving pressure to the atmosphere.