发明授权
- 专利标题： Heating element
- 专利标题（中）： 加热元件
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申请号： US11829077申请日： 2007-07-26
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公开(公告)号： US07837886B2公开(公告)日： 2010-11-23
- 发明人: Bradley D. Chung , Bhavin Shah , Anthony M. Fuller , Ozgur Yildirim , Garrett E. Clark
- 申请人： Bradley D. Chung , Bhavin Shah , Anthony M. Fuller , Ozgur Yildirim , Garrett E. Clark
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： B41J2/04
- IPC分类号： B41J2/04 ; G11B5/127
摘要：
A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.
公开/授权文献
- US20090025634A1 HEATING ELEMENT 公开/授权日：2009-01-29
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