发明授权
- 专利标题： Flip-chip package with fan-out WLCSP
- 专利标题（中）： 具有扇出WLCSP的倒装芯片封装
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申请号： US12370537申请日： 2009-02-12
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公开(公告)号： US07838975B2公开(公告)日： 2010-11-23
- 发明人: Nan-Cheng Chen
- 申请人： Nan-Cheng Chen
- 申请人地址： TW Science-Based Industrial Park, Hsin-Chu
- 专利权人： Mediatek Inc.
- 当前专利权人： Mediatek Inc.
- 当前专利权人地址： TW Science-Based Industrial Park, Hsin-Chu
- 代理商 Winston Hsu; Scott Margo
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A flip-chip package includes a package carrier; a semiconductor die having a die face and a die edge, the semiconductor die being assembled face-down to a chip side of the package carrier, and contact pads are situated on the die face; a rewiring laminate structure between the semiconductor die and the package carrier, the rewiring laminate structure including a re-routed metal layer, and at least a portion of the re-routed metal layer projects beyond the die edge; and bumps arranged on the rewiring laminate structure for electrically connecting the semiconductor die with the package carrier.
公开/授权文献
- US20090294938A1 FLIP-CHIP PACKAGE WITH FAN-OUT WLCSP 公开/授权日：2009-12-03
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