Invention Grant
- Patent Title: Light emitting device and method of manufacturing the same
- Patent Title (中): 发光元件及其制造方法
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Application No.: US12122472Application Date: 2008-05-16
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Publication No.: US07839087B2Publication Date: 2010-11-23
- Inventor: Isao Takasu , Yuko Nomura , Tsuyoshi Hioki , Isao Amemiya , Kazuhide Abe
- Applicant: Isao Takasu , Yuko Nomura , Tsuyoshi Hioki , Isao Amemiya , Kazuhide Abe
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2007-132552 20070518
- Main IPC: H01J1/62
- IPC: H01J1/62
Abstract:
A method of manufacturing a light emitting device. The method includes: mounting a light emitting chip on a substrate; forming a transparent resin portion and a phosphor layer by using a liquid droplet discharging apparatus, the transparent resin portion being formed in a shape of a dome and covering the light emitting chip to fill an exterior thereof on the substrate, a phosphor layer containing phosphor and being formed on an exterior of the transparent resin portion close to at least a top side thereof; and forming a reflecting layer at a position exterior of the transparent resin portion and the phosphor layer close to the substrate.
Public/Granted literature
- US20090021140A1 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-01-22
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