发明授权
- 专利标题： Apparatus and method for improving uniformity in electroplating
- 专利标题（中）： 改善电镀均匀性的装置和方法
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申请号： US11362433申请日： 2006-02-24
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公开(公告)号： US07846306B2公开(公告)日： 2010-12-07
- 发明人: Hooman Hafezi , Aron Rosenfeld
- 申请人： Hooman Hafezi , Aron Rosenfeld
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： G01N27/403
- IPC分类号： G01N27/403 ; C25D17/00
摘要：
A method and apparatus for plating a metal onto a substrate. One embodiment of the present invention provides an apparatus for electroplating a substrate. The apparatus comprises a fluid basin, an anode disposed near a bottom of the fluid basin, a restrictor disposed above the anode, and a substrate support member configured to move the substrate within the fluid basin among different elevations relative to the restrictor. Plating profiles on the substrate may be adjusted by changing the elevation of the substrate during plating.
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