Invention Grant
- Patent Title: Pulsed wave interconnect
- Patent Title (中): 脉冲波互连
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Application No.: US11411228Application Date: 2006-04-26
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Publication No.: US07848222B2Publication Date: 2010-12-07
- Inventor: Pingshan Wang , Edwin C. Kan
- Applicant: Pingshan Wang , Edwin C. Kan
- Applicant Address: US NY Ithaca
- Assignee: Cornell Research Foundation, Inc.
- Current Assignee: Cornell Research Foundation, Inc.
- Current Assignee Address: US NY Ithaca
- Agency: Jones, Tullar & Cooper, P.C.
- Main IPC: H04J7/00
- IPC: H04J7/00

Abstract:
A method for transmitting signals along an interconnect in a VLSI system comprising receivers is disclosed. The VLSI based systems operate in the high Giga hertz range. The signals are transmitted along the interconnect as a localized wave packet i.e. as a pulse. The interconnect may be either electrically linear or nonlinear in nature.
Public/Granted literature
- US20080219293A1 Pulsed wave interconnect Public/Granted day:2008-09-11
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