The present invention relates to a system and method for applying tear tape to a packaging substrate. Features of the system include a tear tape applicator unit comprising a laser/tear tape unwind assembly and a tear tape applicator assembly and a winder comprising an unwind roll and a rewind roll. A packaging substrate is advanced from the unwind roll to the rewind roll. The tear tape applicator unit interfaces the winder such that at least one portion of a tear tape is cut by the laser/tear tape unwind assembly and applied to the web of packaging substrate by the tear tape applicator assembly. Features of the method include advancing a web of a packaging substrate along a rewinding line from an unwind end to a rewind end, cutting at least one portion of a tear tape, advancing said at least one portion of said tear tape toward said rewinding line, and applying said at least one portion of said tear tape to said web.