发明授权
US07855130B2 Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations
有权
用于防止晶圆切片操作期间半导体器件接合焊盘腐蚀的防腐蚀添加剂
- 专利标题： Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations
- 专利标题（中）： 用于防止晶圆切片操作期间半导体器件接合焊盘腐蚀的防腐蚀添加剂
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申请号： US10249576申请日： 2003-04-21
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公开(公告)号： US07855130B2公开(公告)日： 2010-12-21
- 发明人: Robert R Cadieux , Scott A Estes , Timothy C Krywanczyk
- 申请人： Robert R Cadieux , Scott A Estes , Timothy C Krywanczyk
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Richard M. Kotulak
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/46
摘要：
An improved method of dicing a semiconductor wafer which substantially reduces or eliminates corrosion of copper-containing, aluminum bonding pads. The method involves continuously contacting the bonding pads with deionized water and an effective amount of a copper corrosion inhibiting agent, most preferably benzotriazole. Also disclosed, is an improved apparatus for dicing a wafer, in which a copper corrosion inhibiting agent is included in the cooling system for cooling the dicing blade.
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