发明授权
US07855136B2 Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps
有权
使用焊锡凸块和虚拟凸块将半导体芯片安装到电路基板的方法
- 专利标题： Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps
- 专利标题（中）： 使用焊锡凸块和虚拟凸块将半导体芯片安装到电路基板的方法
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申请号： US12007933申请日： 2008-01-17
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公开(公告)号： US07855136B2公开(公告)日： 2010-12-21
- 发明人: Hidenobu Takahira
- 申请人： Hidenobu Takahira
- 申请人地址： JP Tokyo
- 专利权人： FujifilmCorporation
- 当前专利权人： FujifilmCorporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2005-036231 20050214
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A semiconductor chip comprises a silicon substrate on which semiconductor elements are formed, pads, each of which is formed on the silicon substrate and electrically connected to at least one of the semiconductor elements, a first insulating layer having an opening over each one of the pads, a first wiring layer formed on the first insulating layer, electrically connected to the pads and having connecting parts, a second insulating layer formed on the first wiring layer and having openings over the connecting parts of the first wiring layer, electrically functioning solder bumps, each of which is formed on one of the openings of the second insulating layer with electrically connecting to one of the pads via the first wiring layer, and dummy bumps for self adjustment, each of which is formed on one of the openings of the second insulating layer without electrically connecting to the pad.
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