发明授权
- 专利标题： Methods and apparatus for a flexible circuit interposer
- 专利标题（中）： 用于柔性电路插入器的方法和装置
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申请号： US12165203申请日： 2008-06-30
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公开(公告)号： US07855341B2公开(公告)日： 2010-12-21
- 发明人: Douglas C. Chambers
- 申请人： Douglas C. Chambers
- 申请人地址： US ID Boise
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 当前专利权人地址： US ID Boise
- 代理商 Fletcher Yoder
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A substrate having a bending region and conductive paths formed therethrough is provided. In one embodiment, conductive paths are formed from a first region on the bottom surface of the substrate, through the bending region and to a second region on the top surface of the substrate. Methods of using the flexible substrate are also provided.
公开/授权文献
- US20080290342A1 METHODS AND APPARATUS FOR A FLEXIBLE CIRCUIT INTERPOSER 公开/授权日：2008-11-27
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