发明授权
- 专利标题： Method for packaging semiconductor device and package structure thereof
- 专利标题（中）： 半导体器件封装方法及封装结构
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申请号： US11606085申请日： 2006-11-30
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公开(公告)号： US07855424B2公开(公告)日： 2010-12-21
- 发明人: Chain-Hau Hsu
- 申请人： Chain-Hau Hsu
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Rabin & Berdo, P.C.
- 优先权： TW94142663A 20051202
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method for packaging a semiconductor device includes following steps. First, a first substrate including at least one first pattern is provided. At least one semiconductor device is disposed on the surface of the first substrate. Next, a spacer with at least one aperture and at least one through hole is provided. Then, the first pattern is aimed at the through hole to connect the first substrate and the spacer, so that the semiconductor device is positioned correspondingly to the aperture. Afterwards, a second substrate including at least one second pattern is provided. Thereon, the second pattern is aimed at the through hole, so that the second substrate is connected to the spacer correspondingly.
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