Invention Grant
US07858205B2 Bimetallic bond layer for thermal barrier coating on superalloy
有权
双金属接合层,用于超耐热合金上的隔热涂层
- Patent Title: Bimetallic bond layer for thermal barrier coating on superalloy
- Patent Title (中): 双金属接合层,用于超耐热合金上的隔热涂层
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Application No.: US12203248Application Date: 2008-09-03
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Publication No.: US07858205B2Publication Date: 2010-12-28
- Inventor: David B. Allen , Andrew J. Burns , Ramesh Subramanian
- Applicant: David B. Allen , Andrew J. Burns , Ramesh Subramanian
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: B32B15/04
- IPC: B32B15/04 ; B32B18/00

Abstract:
A bimetallic bond layer (26, 28) for a thermal barrier coating or TBC (30) on a superalloy substrate (22) for a high temperature environment. An interlayer (26) is applied on the substrate. A bond coat (28) comprising a CoNiCrAlY or NiCoCrAlY alloy is applied on the interlayer. A ceramic TBC (30) such as 8YSZ is applied on the bond coat. The interlayer (26) is an alloy that is compatible with the substrate and the bond coat, and that blocks or delays diffusion of aluminum from the bond coat into the substrate at high operating temperatures. This preserves aluminum in the bond coat that maintains a beneficial alumina scale (29) between the bond coat and the TBC. This delays spalling of the TBC, and lengthens the coating and component life.
Public/Granted literature
- US20090110954A1 Bimetallic Bond Layer for Thermal Barrier Coating on Superalloy Public/Granted day:2009-04-30
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