发明授权
US07858444B2 Electronic device and method of manufacturing thereof 有权
电子装置及其制造方法

Electronic device and method of manufacturing thereof
摘要:
The device has a carrier and an electric element. The carrier has a first and an opposed side and is provided with an connection layer, an intermediate layer and contact pads. The element is present at the first side and coupled to the connection layer. It is at least partially encapsulated by an encapsulation that extends into isolation areas between patterns in the intermediate layer. A protective layer is present at the second side of the carrier, which covers an interface between the contact pads and the intermediate layer.
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