发明授权
- 专利标题： Wire bonded wafer level cavity package
- 专利标题（中）： 接线晶圆级腔体封装
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申请号： US12283710申请日： 2008-09-15
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公开(公告)号： US07858445B2公开(公告)日： 2010-12-28
- 发明人: Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
- 申请人： Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.
公开/授权文献
- US20090023249A1 Wire bonded wafer level cavity package 公开/授权日：2009-01-22
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