发明授权
- 专利标题: Semiconductor apparatus
- 专利标题(中): 半导体装置
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申请号: US12019228申请日: 2008-01-24
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公开(公告)号: US07859052B2公开(公告)日: 2010-12-28
- 发明人: Wataru Saito
- 申请人: Wataru Saito
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2007-014437 20070125
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/78
摘要:
A semiconductor apparatus includes: a first first-conductivity-type semiconductor layer; a second first-conductivity-type semiconductor layer provided on a major surface of the first first-conductivity-type semiconductor layer; a third second-conductivity-type semiconductor layer forming a periodic array structure in combination with the second first-conductivity-type semiconductor layer in a lateral direction generally parallel to the major surface of the first first-conductivity-type semiconductor layer; and a sixth first-conductivity-type semiconductor layer provided on the major surface of the first first-conductivity-type semiconductor layer in a termination section outside the periodic array structure. The second first-conductivity-type semiconductor layer has an impurity concentration varying in the lateral direction and the impurity concentration is minimized at a center in the lateral direction. An impurity concentration in the sixth first-conductivity-type semiconductor layer is not higher than the impurity concentration at the center of the second first-conductivity-type semiconductor layer.
公开/授权文献
- US20080211020A1 SEMICONDUCTOR APPARATUS 公开/授权日:2008-09-04
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