发明授权
- 专利标题: Back-illuminated type solid-state image pickup device and camera module using the same
- 专利标题(中): 背照式固态摄像装置及使用其的相机模块
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申请号: US12166810申请日: 2008-07-02
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公开(公告)号: US07859073B2公开(公告)日: 2010-12-28
- 发明人: Mie Matsuo , Yusuke Kohyama
- 申请人: Mie Matsuo , Yusuke Kohyama
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2007-178987 20070706
- 主分类号: H01L31/0203
- IPC分类号: H01L31/0203
摘要:
The present invention provides a solid-state image pickup device including an image pickup pixel section which is provided on a semiconductor substrate and in which a plurality of pixels each having a photoelectric conversion element and a field-effect transistor are arranged, and a peripheral circuit section for the image pickup pixel section. An interconnect layer driving the field-effect transistor in the image pickup pixel section is formed on a first surface side of the semiconductor substrate. A light receiving surface of the photoelectric conversion element is located on a second surface side of the semiconductor substrate. The solid-state image pickup device includes a first terminal exposed from the second surface side of the semiconductor substrate, and a second terminal electrically connected to the first terminal and connectable to an external device on the first surface side of the semiconductor substrate.
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