发明授权
- 专利标题： Copper straps
- 专利标题（中）： 铜带
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申请号： US11800125申请日： 2007-05-04
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公开(公告)号： US07859089B2公开(公告)日： 2010-12-28
- 发明人: Kunzhong Hu , Chuan Cheah
- 申请人： Kunzhong Hu , Chuan Cheah
- 申请人地址： US CA El Segundo
- 专利权人： International Rectifier Corporation
- 当前专利权人： International Rectifier Corporation
- 当前专利权人地址： US CA El Segundo
- 代理机构： Farjami & Farjami LLP
- 主分类号： H01L23/485
- IPC分类号： H01L23/485
摘要：
A copper strap for a semiconductor device package having a contact electrically connected to a die electrode, a leg portion electrically connected to a lead frame, a web portion positioned between the contact and the leg portion and connected to the leg portion and a connection region connecting the web portion to the contact. The contact includes a body having a plurality of formations, each of the plurality of formations having a concavity and an opposing convexity positioned to generally face the die electrode.
公开/授权文献
- US20070267727A1 Copper straps 公开/授权日：2007-11-22
信息查询
IPC分类:
