Invention Grant
US07859093B2 Method for protecting encapsulated sensor structures using stack packaging
有权
使用堆叠包装保护封装的传感器结构的方法
- Patent Title: Method for protecting encapsulated sensor structures using stack packaging
- Patent Title (中): 使用堆叠包装保护封装的传感器结构的方法
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Application No.: US11903490Application Date: 2007-09-21
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Publication No.: US07859093B2Publication Date: 2010-12-28
- Inventor: Karsten Funk
- Applicant: Karsten Funk
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A method of protecting a micro-mechanical sensor structure embedded in a micro-mechanical sensor chip, in which the micro-mechanical sensor structure is fabricated with a protective membrane, the micro-mechanical sensor chip is arranged so that a surface of the protective membrane faces toward a second chip, and the micro-mechanical sensor chip is secured to the second chip.
Public/Granted literature
- US20080237826A1 Method for protecting encapsulated sensor structures using stack packaging Public/Granted day:2008-10-02
Information query
IPC分类:
