发明授权
- 专利标题: Fault tolerant laser diode package
- 专利标题(中): 容错激光二极管封装
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申请号: US11975951申请日: 2007-10-23
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公开(公告)号: US07860136B2公开(公告)日: 2010-12-28
- 发明人: Edward F. Stephens, IV , Joseph L Levy , John S. Whiteley
- 申请人: Edward F. Stephens, IV , Joseph L Levy , John S. Whiteley
- 申请人地址: US CA Los Angeles
- 专利权人: Northrop Grumman Systems Corporation
- 当前专利权人: Northrop Grumman Systems Corporation
- 当前专利权人地址: US CA Los Angeles
- 代理机构: Nixon Peabody LLP
- 主分类号: H01S3/00
- IPC分类号: H01S3/00
摘要:
A laser diode package (10) according to the present invention is tolerant of short-circuit and open-circuit failures. The laser diode package (10) includes a laser diode bar (12), a forward-biased diode (14), a heat sink (18), and a lid (16) which may have fusible links (86). The laser diode bar (12) and the forward-biased diode (14) are electrically connected in parallel between the heat sink (18) and the lid (16). The emitting region of the laser diode bar (12) is aligned to emit radiation away from the forward-biased diode (14). Several packages can be stacked together to form a laser diode array (42). The forward-biased diode (14) allows current to pass through it when an open-circuit failure has occurred in the corresponding laser diode bar (12), thus preventing an open-circuit failure from completely disabling the array (42). The fusible links (86), if used on the lid (16), prevent damaged active regions (90) in a laser diode bar (12) from short-circuiting and drawing more electrical current than the other active regions (90).
公开/授权文献
- US20080056316A1 Fault Tolerant Laser Diode Package 公开/授权日:2008-03-06