发明授权
- 专利标题： Interspinous process spacer
- 专利标题（中）： 棘突间隔
-
申请号： US11102396申请日： 2005-04-08
-
公开(公告)号： US07862590B2公开(公告)日： 2011-01-04
- 发明人: Roy Lim , Michael C. Sherman
- 申请人： Roy Lim , Michael C. Sherman
- 申请人地址： US IN Warsaw
- 专利权人： Warsaw Orthopedic, Inc.
- 当前专利权人： Warsaw Orthopedic, Inc.
- 当前专利权人地址： US IN Warsaw
- 代理机构： Coats and Bennett, P.L.L.C.
- 主分类号： A61B17/70
- IPC分类号： A61B17/70
摘要：
Embodiments of an interspinous spacer that maintains spacing between a superior vertebra and inferior vertebra following a laminectomy. The interspinous spacer may include a superior arch engaging the spinous process of a superior vertebra and an inferior arch engaging the spinous process of an inferior vertebra. The superior arch and inferior arch may define a central opening in the interspinous spacer.
公开/授权文献
- US20060241610A1 Interspinous process spacer 公开/授权日：2006-10-26
信息查询
