发明授权
- 专利标题： Image sensor package and method of manufacturing the same
- 专利标题（中）： 图像传感器封装及其制造方法
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申请号： US11150825申请日： 2005-06-10
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公开(公告)号： US07863702B2公开(公告)日： 2011-01-04
- 发明人: Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
- 申请人： Byoung-Rim Seo , Jae-Cheon Do , Yung-Cheol Kong , Seok-Won Lee
- 申请人地址： KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- 代理机构： Muir Patent Consulting, PLLC
- 优先权： KR10-2004-0042501 20040610; KR10-2005-0037018 20050503
- 主分类号： H01L29/78
- IPC分类号： H01L29/78
摘要：
An image sensor package assembling method includes providing a substrate on which a plurality of image sensors are mounted; providing a housing strip having a plurality of housings arranged corresponding to an arrangement of the image sensors on the substrate, each of the housings having an aperture corresponding to an active surface of the corresponding image sensor and a cavity enclosing an edge of the corresponding image sensor; attaching a transparent cover plate sealing the apertures of the housings on the housing strip after attaching the housing strip on the substrate; and separating image sensor packages from each other by successively cutting the transparent cover, the housing strip and the substrate. Increased yield and production efficiency can be realized.
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