发明授权
- 专利标题: Cover assembly for electronic device
- 专利标题(中): 电子设备盖组件
-
申请号: US12503849申请日: 2009-07-16
-
公开(公告)号: US07864511B2公开(公告)日: 2011-01-04
- 发明人: Wen-Yan Yang
- 申请人: Wen-Yan Yang
- 申请人地址: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 专利权人: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 代理商 Frank R. Niranjan
- 优先权: CN200910300917 20090317
- 主分类号: H05K5/00
- IPC分类号: H05K5/00 ; H05K7/00
摘要:
A cover assembly includes a housing plate and a cover. The housing plate includes a first wall, a second wall, a third wall, and a fourth wall. The housing plate defines a rectangular opening. The first, second, third, and fourth walls are formed at the four edges of the rectangular opening. The housing plate defines a first positioning slot in the first wall, two second positioning slots at one end of the second wall and the third wall adjacent to the first wall, and a third positioning slot at a side of the rectangular opening. The cover includes a front end, an opposite rear end, a first locking sheet on the middle of the front end, two second locking sheets on both sides of the front end, and two third locking sheets on the inner surface of the disassembly portion and protruding from the rear end to the front end.
公开/授权文献
- US20100238613A1 COVER ASSEMBLY FOR ELECTRONIC DEVICE 公开/授权日:2010-09-23
信息查询